Ltcc Ceramic Package

Agcu eutectic or low temperature soldering e g.

Ltcc ceramic package.

Components for fiber optic connectors. Our custom made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance. Optical packages htcc is a practical choice or optical applications packages due to hermeticity flatness capability and stable over a wide temperature range. Htcc components generally consist of multilayers of alumina or zirconia with platinum tungsten and molymanganese metalization.

Ltcc also features the ability to embed passive elements such as resistors capacitors and inductors into the ceramic package minimising the size of the completed module. The multilayer ceramic is co fired at high temperatures to form a solid and hermetic ceramic. These fabrication technologies provide unique solutions for high interconnect density compact networks and high. High strength materials ltcc hard.

Ceramic packages and optical filters for image sensors. Ausn eutectic process steps. They offer excellent resistance to the shock of drop testing and are well suited as module substrate materials in mobile communication devices. 2 3 low cost multilayer ceramic package for flip chip mmic up to w band.

A low cost multilayer low temperature co fired ceramic ltcc package based on a mass production design rule for an mmic up to w band has been developed. High lead count packages. Ltcc low temperature co fire ceramics is a multi layer glass ceramic substrate which is co fired with low resistance metal conductors at low firing temperature less than 1000. Neo tech has emerged as north america s leading manufacturer of quality low temperature co fired ceramic ltcc and high temperature co fired htcc substrates and packages.

High reliability ceramic substrates ltcc htcc. Schott is also able to supply low temperature cofired ceramic ltcc housings through its partnership with via electronic. Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions such as micro electronic mechanical systems mems and high frequency applications because such packages are hermetic and. Surface mount ceramic packages for electronic devices.

For htcc a final metal coating e g. Package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density hermetic packaging solutions available. It is sometimes referred to as glass ceramics because its composition consists of glass and aluminum. Kyocera s ltcc hard materials have a high flexural strength 400mpa that is equivalent to alumina ceramics.

Ltcc substrate with embedded passive components. Ceramic packages for mems sensors. A plated ni or ni au coating on the accessible metal structures offers the possibility for high temperature brazing using e g. Ceramic packages for power electronics.